Quantcast
Channel: Embedded Community : All Content - All Communities
Viewing all articles
Browse latest Browse all 3140

Xeon D processor-based high performance OpenVPX DSP cards meet compute-intensive C4ISR application needs

$
0
0

Curtiss-Wright’s Defense Solutions division has begun shipments of its family of rugged Digital Signal Processing (DSP) engine modules based on the Intel® Xeon® processor D (code-named "Broadwell-DE"). The open architecture compute engines, designed for use in very compute-intensive C4ISR aerospace and defense applications, are the industry’s first to deliver supercomputing-class processing to rugged 3U and 6U VPX architecture COTS environments. 8-core and 12-core versions of the Xeon processor D-based small form factor 3U OpenVPX™ CHAMP-XD1 and Early Access Unit versions of the 6U OpenVPX CHAMP-XD2 DSP modules have already been delivered and are currently under evaluation by almost all of the aerospace and defense market’s leading Tier 1 and Tier 2 Prime Contractors.

 

The CHAMP-XDx module family delivers unprecedented Intelligence, Surveillance and Reconnaissance (ISR) processing capabilities to embedded systems deployed in airborne and ground, manned and unmanned programs. The CHAMP-XDx module family is designed for the most demanding deployed High Performance Embedded Computing (HPEC) systems, including next-generation Radar, EW and a wide range of C4ISR applications.

 

CHAMP-XD1 3U OpenVPX Xeon D-based DSP Processor CardCHAMP-XD2 6U OpenVPX Xeon D-based DSP Processor Card
CHAMP-XD1-VPX3-482-Intel-XeonD-DSP-prime.gifCHAMP-XD2-VPX6-483-Intel-XeonD-DSP.gif

Key Features

  • Intel Xeon D 8-Core (410 GFLOPS @ 1.6 GHz) or 12-Core (576 @ 1.5 GHz)
  • Extended operating temperature Intel eTEMP SKUs
  • PCH integrated in Xeon D SoC
  • Native dual KR 10 GigE ports
  • 16 to 32 GB DDR4 @ 2133 megatransfers per second (34 GB/s aggregate)
  • XMC PCIe up to Gen3, designed for up to 25W thermal dissipation
  • PCIe Gen3 on 3U OpenVPX data plane with switch
  • Core Function FPGA with IPMI
  • Rugged conduction and air-cooled versions available
  • TrustedCOTS

Key Features

  • Dual processor Xeon D 8-core (820 GFLOPS @ 1.6 GHz total) or 12-core (1152 GFLOPS @ 1.5 GHz total)
  • Extended operating temperature Intel eTEMP SKUs
  • PCH integrated in Xeon D SoC
  • Four ports of 40G/10G Ethernet or DDR/QDR/FDR10 InfiniBand on OpenVPX data plane
  • Native dual KX 1 GigE or KR 10 GigE ports on OpenVPX control plane
  • 16 to 32 GB DDR4 @ 2133 megatransfers per second per Xeon D socket (68 GB/s aggregate)
  • XMC PCIe up to Gen 3, designed for up to 25W thermal dissipation
  • Dual x16 PCIe Gen 3 on OpenVPX expansion plane with switch
  • Core Function FPGA with IPMI
  • Rugged conduction and air-cooled versions available
  • TrustedCOTS

Viewing all articles
Browse latest Browse all 3140

Trending Articles



<script src="https://jsc.adskeeper.com/r/s/rssing.com.1596347.js" async> </script>