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下载页面中的Edison集成安装器(Windows 64-bit Integrated Installer)是给64位系统使用的,32位系统怎么办?

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如果使用的是32位操作系统,则需要手动安装所有内容,包括驱动和IDE等。在Edison的下载页面中都有相关内容的独立下载链接供您下载。详细指导可参考以下链接:

https://software.intel.com/en-us/installing-drivers-for-intel-edison-board-with-windows

 

 

 

(更多智能系统的技术交流,请关注我们微博weibo.com/onlinesalesgroup、并浏览我们官方社区http://embedded.communities.intel.com/community/zh_cn,或者官方技术交流QQ群120966104


为什么Arduino IDE中的一些sample sketch无法在Edison上正常工作?

哪里可以找到Edison Yocto Linux的内核源码树?

工业强度的小型插板

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    随着物联网 (IoT) 和智能工厂采用的增加,当今的制造商需要符合以下要求的工业设备:

  • 提供增强的连接性、性能和操作监控
  • 适合车间空间有限的环境
  • 提供必要的多核计算能力,以整合多个操作系统 (OS) 及其应用
  • 在虚拟化环境中提供实时、稳定的性能
  • 可在全天候 (24×7) 操作条件下安全可靠地运行

要做到这些,困难重重。 为了帮助开发人员满足这些要求并且提供改善工厂运行所需的实时智能和控制,Intel 在 2015 年推出了第 5 代 Intel® Core™ 处理器产品系列(H 处理器系列)。 专为在 IoT 使用模式中提供高性能和价值而制,这些处理器可提供更高的性能、增强的可管理性、更丰富的显卡支持以及改进的安全性技术,从而实现可日复一日地发挥作用的紧凑而强大的解决方案。 来自 Intel® 物联网联盟成员的两种小型插板现已在这些高级处理器中提供。 但在我们详细讲述前,我们先来深入了解下让这些插板非常适合工业应用的处理器增强功能。 第 5 代 Intel® Core™ 处理器

基于 Intel 的行业领先 14 nm 处理技术而制造且采用第 2 代 3D 三栅极晶体管,第 5 代 Intel® Core™ i7 处理器可提供强大的 CPU 性能。 47 W TDP 处理器包括很多特色功能,正是这些功能使之成为工业自动化的不二之选:

  • 四核设计 – 凭借使可用线程数翻倍的四核和 Intel® 超线程技术,这些处理器提供很多重型工作负载和虚拟化工作负载所需的性能。
  • 集成显卡– 这些处理器配备最新的 Intel® Iris™ Pro Graphics 6200,因此可以实现清晰、生动的 HMI 视觉效果,而无需使用独立显卡。 显卡支持超高清 4K 分辨率和多达三个独立显示屏。
  • 安全性 – 这些处理器的硅级安全性包括 Intel® OS Guard,有助于防止连接的设备及其数据被篡改和遭受恶意软件攻击,并且不会影响系统运行。 采用 BIOS 防护的 Intel® 数据保护技术可防止固件遭受未经授权的修改。 来自 Secure Key 技术的传输中数据以及 Intel® 高级加密标准新指令 (Intel® AES-NI) 的新扩展可加快密码工作负载并减少其在处理器上的负载。
  • 可管理性 – 通过启用 Intel® vPro™ 技术,这些处理器可提供增强的远程带外管理。 此技术可帮助减少维护成本和修理时间,并且保持强大、高效和灵活的运维。
  • 灵活性 – Intel® Flex I/O 支持快速连接,且可灵活分配不同数量的集成 I/O 技术,包括 SATA 6.0 Gbps、USB 3.0 和 PCI Express* 2.0 端口。 这一灵活性可让这些处理器满足多种配置需求(图 1)。
  • 功率管理 – 该处理器的自动化低功耗状态可通过基于实时处理器负载调节功率来帮助降低能源成本。
  • 虚拟化 – 这些处理器集成 Intel® 虚拟化技术 (Intel® VT) 以加快平台控制的传输和虚拟机监视器 (VMM) 和其他平台代理之间的数据移动(包括客户端 OS 和 I/O 设备)。 此技术减少了 VMM 上的工作负载,可应对诸如迁移旧有软件、增加实时性能和增强应用安全性等设计挑战。
  • 操作系统支持 – 第 5 代 Intel® Core™ 处理器支持 Linux*、Wind River* VxWorks* RTOS 和 Microsoft Windows*。 通过虚拟化,这些处理器可同时支持多个操作系统,比如用于实时同步的 RTOS 和用于 HMI 的操作系统。
  • 可选错误校正码 (ECC) 内存支持– 当插板制造商启用时,这些处理器的 ECC 支持可实现多比特内存错误检测。 校正单比特错误时,系统可保持运行状态。

[caption  id="" align="aligncenter" width="640"]

图 1.方块图显示第 5 代 Intel® Core™ 处理器产品系列的丰富 I/O。[/caption]

采用第 5 代 Intel® Core™ 处理器的小型插板采用这些全新高级处理器的插板支持传统上分散的子系统 – 比如移动控制、可编程的逻辑控制 (PLC)、人机接口 (HMI) 以及机器视觉 – 纳入单个计算系统。 该组合解决方案可将实时通用应用托管在一起,就如同各自在各自专用计算机上运行一样。 联盟Associate级成员 Axiomtek 提供了助力此类解决方案的插板典范:CEM880 COM Express Type 6 模块(图 2)。适用于 Intel® Core™ i7-5850EQ 或 Intel® Core™ i7-5700EQ 处理器,此插板包括一个板载 4 GB 扩展温度 DDR3L 芯片和一个支持高达 8 GB 的 204 引脚 SO-DIMM DDR3L 插口。提供出色的计算性能、低功耗和广泛的温度范围以及抗震设计,这款坚固耐用的基本尺寸模块上系统 (SoM) 推动了 IOT 创新,并且是工业自动化和能源应用的理想之选。

[caption  id="" align="aligncenter" width="394"]

图 2.Axiomtek 的 CEM880 COM Express Type 6 模块[/caption]

与 Axiomtek 的基板 CEB94006 或用户提供的载频板相结合,CEM880 模块支持一个 PCIe x16 v3.0、八个 PCIe x1 设备和最多 24 路 PCIe,以提供丰富的 I/O 选项。 该处理器的 Intel® Iris™ Pro Graphics 6200 和 Intel® HD Graphics 5600 为 CEM880 分别提供显著提升的显卡和媒体性能,以及顺应高清晰度显示需求不断增长的趋势。 显卡输出包括 VGA、LVDS 和三个支持 HDMI/DVI/DisplayPort 的 DDI 端口。 其他 I/O 包括采用 Intel® Smart Response 技术的四个 SATA-600、支持局域网唤醒的 1 GB 以太网端口、高清音频接口、一个 LPC 接口、一个 SPI 接口、四个输入和输出数字 I/O 通道、八个 USB 2.0 端口以及四个 USB 3.0 端口。而且,为了保证可管理性、安全性和可靠性,该模块支持硬件监视器、TPM 1.2、SMBus 和一个监视时钟。 还提供一个 COM Express 模块,联盟Affiliate级成员 MSC Technologies 采用第 5 代 Intel Core 处理器。 MSC C6B-8SB 模块适用于 Intel Core i7-5850EQ 或 i7-5700EQ 处理器且支持三个独立的显示屏、快速低功耗 DDR3L-1600 内存以及 USB 3.0(图 3)。除了大量的接口和特色功能,MSC C6B-8SB 对 CPU 和显卡控制器均采用 Intel® Turbo Boost 功能,可为应用在所需之时提供更出色的处理和显卡性能。它还采用 Intel 基于硬件的安全功能,以实现可信计算组织 (TCG) 指定的可信计算。 [caption  id="" align="aligncenter" width="386"]

图 3.MSC Technologies 的 MSC C6B-8SB COM Express Type 6 模块。[/caption]

 

此模块的 Type 6 引脚输出支持直接访问最新的数字显示接口,比如 DisplayPort、HDMI 和 DVI。四个 USB 3.0 接口支持目前可用的最快速外围设备。

开始您的工业革命上面提及的 Axiomtek 和 MSC 插板只是联盟成员提供的搭载 Intel® Core™ 处理器或其他 Intel® 多核处理器的工业强度产品中的两款。 您可在我们的“解决方案目录”中找到更多工业解决方案。 您还可以浏览此社区,了解更多有关工业解决方案的信息。

了解更多
联系推荐的联盟成员:
  • 联系Axiomtek>>
  • 联系MSC Technologies>>
此博客中的解决方案:
  • Axiomtek CEM880
  • MSC Technologies MSC C6B-8SB
相关主题:
  • 性能 - 热门精选(博客、白皮书等)
  • 虚拟化 - 热门精选(博客、白皮书等)
  • 工作负载整合 - 热门精选(博客、白皮书等)
  • 工业 - 热门精选(博客、白皮书等更多)

Axiomtek是Intel®物联网解决方案联盟的Associate级成员,

MSC Technologies为Affiliate级成员。

Making Intel® 82543GC Gigabit Ethernet Controller driver work for intel i210 controller

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Hello ,

on vxworks platform , I need to make driver designed for Intel 82543 Ethernet controller work for Intel i210.

I tried booting the BSP image , it showed below mentioned errors.

1. EEPROM checksum Error

2. No PHY detected in MII bus scanning. ( No PHY available in MII )

Can anyone suggest me further to remedy.

Linux proc/interrupts ERR counter increments for each CPU on periodic SMI event.

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Hi,

 

I have the following problem. When periodic SMI events are enabled the APIC error interrupt gets triggered for each CPU. I run the tests on a board with E3845 and use the default interval of 64 seconds.

 

Each 64 seconds Linux ERR count are increased with 4. If I disable periodic events, the ERR counter will stay at 0. The SMI is generated by chipset and thus it triggers all CPUs.

 

Any idea of how to avoid this behavior except disabling SMIs? I expect that chipset SMIs should not end up as APIC error interrupts, like spurious interrupts will do. Other than the 4 APIC error interrupts each minute, I have no abnormal interrupt activity.

 

Any ideas?

 

Best regards,

 

B-O

45-000018-R6 PCIe x1 2.5GT/s 1000Base-T GbE Controller -40-85C Intel WGI210ITSLJXS Integrated Circuit Digital, CMOS

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Hi,

Please can you let us know the number of gates in the following IC

 

 

45-000018-R6    PCIe x1 2.5GT/s 1000Base-T GbE Controller -40-85C           Intel       WGI210ITSLJXS               Integrated Circuit             Digital, CMOS

 

 

Best regards

Javed

Carrier Network Virtualization Palo Alto, CA November 30th to December 3rd

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Informa Telecoms & Media is delighted to reunite the global SDN & Network Virtualization community for this comprehensive SDN & NFV event for the carrier community, packed with case studies from the pioneers at the very forefront of SDN and NFV advancements worldwide. Set in California, the heartland of SDN & NFV solutions, Carrier Network Virtualization brings the industry together to discuss Carrier Class SDN from a unique strategic carrier-led perspective. The event will examine the steps needed to further deployments of SDN and NFV, featuring the Intel Network Builders workshop and a brand new MEC focus day in addition to dedicated tracks and keynotes on Business Models and Evolution, Openness and Collaboration, Management and Orchestration, Monetization and Quality Assurance.

 

 

This is an Intel sponsored event

 

Register here


POE LAN on Motherboard

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I don't know if The correct term is LOM but I am looking for a motherboard I can load an OS on but it should have POE ethernet ports as well. I am looking to have this board have anywhere between 4 to 48 ports. Can anyone help?

Roving Reporter: Make a Power Play with Three Gaming Boards

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As casinos watch their core customer base age and drop in numbers, they’re looking for ways to get millennials into the game. To lure them, casinos are placing bets on a new generation of games that require skill and not just chance. For gaming machine makers, that means building more powerful systems that deliver the performance and graphics these game require.

 

The timing is perfect. With the recent release of the 6th generation of Intel® Core™ processor product family, there is a solid selection of boards available that deliver the fast action and visual excitement of the latest games, as well as the enhanced security features casinos need.

 

A Processor Built for Action and Games

In development for more than four years, the Skylake microarchitecture used in the 6th generation Intel Core processor family provides the advanced compute and graphics performance needed for high-resolution video playback, seamless game play, and many other enhancements (Figure 1). The extreme scalability of the processors enables boards targeting everything from fanless systems drawing as low as 15 W (Thermal Design Power) to powerful platforms for the most demanding gaming enthusiasts.

 

is090207.jpg

Figure 1. The Skylake microarchitecture used in the 6th generation Intel® Core™ processors delivers enhancements in nearly every aspect of processor and graphics performance. (Click picture to enlarge.)


Harnessing the power of Intel’s leading 14nm process and latest 3D transistors, 6th generation Intel Core processors pack more performance into a smaller space. The result is powerful small form factors capable of mainstream gaming capabilities.

 

Support for the latest DDR4 SDRAM enables higher data rate transfer speeds for more responsive game play. To further amplify performance, Intel® Core™ i7 and i5 processors include Intel® Turbo Boost Technology 2.0. This feature dynamically increases processor frequency as needed, taking advantage of thermal and power headroom to give compute or graphics tasks a burst of speed when they need one and increased energy efficiency when they don’t. Intel Turbo Boost is perfect for gaming systems because it can fire up performance to handle fast-paced action such as a rapid transition to a new game environment. 

 

As for graphics, the stunning visuals available from these processors’ integrated graphics eliminate the need and the extra cost of a discrete graphics card. Videos come to life in Ultra HD 4K for vibrant multimedia experiences on Ultra HD and 4K displays (up to 4096x2304 resolutions). The processors support HEVC (H.265), VP8, and VP9, plus accelerate video functions with Intel® Quick Sync Video technology. Native support for the new Direct X 12 API ensures a better experience on the many games coming out with support of DirectX 12.

 

These latest processors also address security. Casinos need to protect systems against malware used to increase winnings or gain access to the casino’s network. The 6th generation Intel Core processors offer advanced hardware-level security features such as:

  • Intel® Software Guard Extensions (Intel® SGX) that help protect the gaming system and its data
  • Intel® Memory Protection Extensions that help protect an application’s run-time integrity
  • Intel® Device Protection Technology with BIOS Guard 2.0 and Boot Guard to help protect the system during boot
  • Intel® OS Guard that protects the operating system (OS) kernel, preventing use of malicious data or attack code from taking over or compromising the kernel

 

Three Ways to Build Skill-Based Casino Game Platforms

As you might expect, what’s good for PC-based enthusiast gaming platforms is good for machines designed to bring millennials onto the casino floor.

 

ADLINK equips its AmITX-SL-G Mini-ITX board to suit a variety of gaming platforms through a range of 6th generation Intel® Core™ i7/i5/i3 processors (Figure 2). The board is available with up to 32GB of dual channel DDR4 at 2133MHz and three DisplayPort (DP) outputs for running up to three independent displays at up to 4096 x 2160. For audio, 7.1 channel audio will keep gamers in their seats.

 

ADLINK AmITX-SL-G_bimg_en_3.jpg

Figure 2. ADLINK AmITX-SL-G Mini-ITX board


Expansion and I/O are extensive. PCI Express (PCIe) slots include one PCIe x16 Gen3, one PCIe x1 Gen2, one Mini PCIe full-size slot, and one Mini PCIe half-size slot. The board offers three SATA 6 Gbps ports, plus four USB 3.0, three USB 2.0, one RS-232/422/485, and three RS-232 serial ports. For networking, an Ethernet controller is included.

 

AAEON’s Mini-ITX board, the EMB-H110B, is a low profile unit set up for a range of 6th generation Intel Core processors (Figure 3). The board handles up to 32GB of dual channel DDR4 and can power two independent displays (DP/HDMI). Realtek audio delivers the soundscape.

 

gal_20150902_9zzv.jpg

Figure 3. AAEON EMB-H110B Mini-ITX board


Expansion and I/O includes one PCIe x1, one half-size Mini-Card (PCIe + USB) x 1, one full/half-size Mini-Card x 1 (default: SATA 6.0Gb/s), four USB 3.0 ports, and six USB 2.0 ports (two ports for Mini Card, four ports at mid-board). An Ethernet controller is included.

 

The Avalue EMX-Q170 Mini-ITX board is a high-end performer with excellent power management for gaming applications (Figure 4). It supports up to 32GB dual channel DDR4 2133MHz system memory and triple independent display (VGA, HDMI, DP). The I/O includes one full/half-size Mini PCIe with mSATA support, one SIM card slot, one full/half-size Mini PCIe for WiFi module, one PCIe x16, four USB 3.0, six USB 2.0, six COM ports, six SATA III (one switch by jumper for mSATA) and 8-bit GPIO. Realtek 5.1 channel audio provides the sound experience. The unit includes two LAN ports.

 

Avluae EMX-Q170-2.png

Figure 4. Avalue EMX-Q170 Mini-ITX board


Game On in the Casino

To find out more about these and other boards that use 6th generation Intel Core processors to offer the muscle to bring skill-based games to the casino floor, check out our regularly updated Solutions Directory.

 

 

Learn More

Solutions in this blog:

 

Related topics:

ADLINK is a Premier member of the Intel® Internet of Things Solutions Alliance. AAEON and Avalue are Associate members of the Alliance.

 

Mark Scantlebury

Roving Reporter (Intel Contractor), Intel® Internet of Things Solutions Alliance

Editor-in-Chief,Embedded Innovator magazine

EMGD driver problem on E3825 and directShow.

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I am using DirectShow and a Hauppauge video capture card to preview video on a E3825 unit.   It is running Win7 32 bit with display driver version 36.15.0.1091 (Driver date 6/26/2014).

 

My problem is when I use DirectShow and build a filter graph if I use any of the Renderers that directly use the YUY2 data from the capture board then the video on the screen is wrong (see picture below)

Non-working video.jpg  Non-working Video graph.jpg

and sometimes I get an error message  Graphics driver error.jpgso this seems to be a error with the display driver. 

Working video and graph ..... but takes 20% of CPU to run this because of the AVI Decompressor.

 

working video.jpgworking graph.jpg

I also tried this on the same hardware running Win8.1 64 bit and the Video was still wrong but did not get the error message.    I also tried this on a module using the N2930 and had the same problem.

Next I tried the same capture board in two other PCs and it worked fine.  One PC had a intel CPU but a ATI graphics card the other had a AMD processor with build in graphics. 

 

So my questions :

1. Is there a newer driver I should try? 

2. Any other tests I should run?

3. Does anyone else have this problem?

4. I have asked my module company and have tried updating to the latest BIOS and firmware but still the same issue.  So I have raised the issue with their support but is there anyone else at Intel I should ask?

 

Tom

i210 Windows Driver Won't Start

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We're developing an Ethernet NIC based on the i210-IS and the Marvell 88E6097F (a multi-port switch).  SGMII is the interface between these two devices.  Our development platform is 64-bit Windows 7 Embedded.

 

I have programmed the i210 with the file Dev_Start_I210_Sgmii_NOMNG_16Mb_A2_3.25_0.03.bin (the flash is Microchip SST25VF016B -- a 16 Mbit part).  I have not attempted to modify the image in flash in any way (not even changing the MAC address -- which I can't do either, but that's another problem).  I am using the latest versions of both the tools and firmware (both downloaded from Intel in the last couple of days).

 

I have verified using EEUPDATE that the device can be found and has a PID of 0x1538.  EEUPDATE also confirms that the flash checksum is good.

 

As a double-check, I used the lanconf tool to verify that the image data is present in both flash and shadow EEPROM.

 

I have not programmed the iNVM.  Inspecting it using lanconf shows that it is uninitialized.

 

This all seems good, but when I install the driver the i210 is recognized and the driver is installed, but in Device Manager the i210 is non-functional and the reason given is "the device won't start (error 10)".

 

Our system also has an i218-LM in it and that part functions properly (the driver supports both of these devices).

 

There is no problem on the PCIe bus.  The lanconf tool shows that the PCI registers have been initialized.  I can use lanconf to inspect the internal registers of the i210.

 

I have compared our schematic with the reference one and the only difference is that we have pulled the SECURITY_EN (NVM_SI) signal low to facilitate development.

 

From the comments I see in other discussions, it seems that programming the firmware was sufficient to get the i210 up and running.  If there is any step that I have overlooked, please let me know.

 

Any assistance would be most appreciated.  If you need any more information or want me to perform some tests, please don't hesitate to ask.

Axiomtek New Fanless, Wide Temperature Pico-ITX Motherboard with Flexible Cabling - PICO843

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Axiomtek, one of the world's leading designers and manufacturers of innovative, high performance and reliable PC-based industrial computer products, announced the arrival of the PICO843, an extreme-compact fanlessPico-ITX motherboard with flexible cabling. The durable PICO843 is designed to support the Intel® Celeron® processors quad-core J1900 and dual-core N2807 (codename: Bay Trail) with one DDR3L 1066/1333 up to 8 GB memory. The Pico-ITX motherboard is capable of operating under wide temperatures from -20°C to +70°C. Its fanless design and low power consumption also offers better reliability and power savings. The ultra-slim size easily meets compact size requirements for space limited or harsh applications. Its I/O functions all come from internal connectors enabling super slim, flexible wiring design. The Axiomtek PICO843 is ideal for in-vehicle PCs, medical imaging, gaming, in-flight entertainment systems, industrial automation systems, and the portable devices.

 

“Axiomtek’s new Pico-ITX single board computer PICO843 is a great choice for customers who need an embedded board with rich I/Os, low power, and extreme small form factor. Customers can enjoy the advantage of good thermal design to running it in wide temperatures and fanless operation. Furthermore, to increase the connectivity and reliability, the rich feature of I/O interfaces are integrated to allow flexible cabling. This great graphics performance SBC features dual-view compatibility through VGA and LVDS,” said Michelle Mi, product manager of Product & Marketing Division at Axiomtek.

 

Axiomtek's rugged embedded Pico-ITX motherboard, PICO843, comes with advanced connectivity including two RS-232/422/485, four USB 2.0, one Gigabit Ethernet, HD audio, VGA, 18/24-bit single channel LVDS, SATA-300, and full-size & half-size PCI Express Mini Card slots. To ensure reliable operation, the fanless yet wide temperature embedded SBC supports watchdog timer and hardware monitoring features. The Intel® Bay Trail embedded board platform runs well with Windows® 7/8 operating systems. In the meanwhile, the PICO843 requests only +12V DC power input into work.

 

The fanless Pico-ITX motherboard PICO843will be available around the beginning of December, 2015. Axiomtek provides a wide array of intelligent IoT & M2M solutions, network communication platform, industrial panel PCs, systems & platforms and embedded boards & modulessolutions. For more product information or pricing, please visit our global website at www.axiomtek.com or via Facebook, Twitter and YouTube. Please contact one of our sales representatives at info@axiomtek.com.tw.

 

Main Features:

  • Pico-ITX form factor motherboard with fanless design
  • Intel® Celeron® processor J1900 quad-core (2GHz up to 2.42 GHz) or N2807 dual-core (1.58GHz up to 2.16 GHz) (codename: Bay Trail)
  • One DDR3L SO-DIMM supports up to 8GB memory capacity
  • Supports four USB 2.0 and one Gigabit LAN
  • Two COM ports (RS-232/422/485 selectable)
  • One full-size PCI Express Mini Card with mSATA support and one half-size PCI Express Mini Card
  • Supports wide operating temperature of -20°C to +70°C (-4°F to +158°F)
  • +12V DC power input

 

Visit Axiomtek at SmartRail Asia in Bangkok

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Visit Axiomtek at SmartRail Asia in Bangkok

 

Axiomtek will showcase its latest transportation solutions for the SmartRail Asia Congress & Expo that takes place in Bangkok, Thailand from November 25 ~ 27.

 

In our booth C18 of Hall 106, Axiomtek will be displaying our newest railway embedded system and railway panel PC, tBOX810-838-FL and GOT710-837, which both features Intel® Atom™ E3845 and targeted for railway applications.  These intelligent transportation solutions are fanless, extended temperature, rugged, low power consumption and have their own respective railway and transportation certifications.  There are more smart embedded solutions in our booth and featuring Axiomtek’s AXView for intelligent remote management & control solution.   

 

Don’t forget to stop by our booth at C18 and explore a verity of industrial & embedded products to complete your railway solution.

Custom USB

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Hello,

I am looking custom usbs for my company promotion anybody suggest me best companies.Those are providing custom usb products.

 

Thanks 


High integrity CompactPCI S.0 Intel Core i7 based conduction cooled solution for your mission critical application

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The integrated onboard automated control systems are currently considered as advanced and multifunctional platforms providing solutions for a wide range of tasks. In such a case, depending on the type of a vehicle, they can either assist human-operators and expand opportunities (a classic example here is the onboard avionic system on a manned aircraft) or can be the main (sometimes the only one) command center of any self-propelled robotized vehicle (Unmanned aerial vehicles (UAVs), unmanned underwater vehicles (UUVs), spacecraft etc.). The core of such control platforms is the onboard computing system — a special-purpose Box PC, usually controlled by real-time operating system and using peripheral equipment for connection to the systems of data acquisition and vehicle control.

The need for real-time control of the vehicle and for significantly increased processed data flows (e.g. analysis of data from radar stations, recognition of graphic images, encryption/decryption of data flows) imposes very strict requirements on the processing speed of computing system, which determines the growth of its power consumption as well as requirements for power supply and cooling systems accordingly. Under normal conditions, such tasks usually require the use of embedded computers with modular form-factorsbased on modern high-speed serial interfaces such as: CompactPCI Serial, AdvancedTCA, MicroTCA, VXS etc. In this case, when it comes to design, these computers use various standard 19» enclosures and are cooled by powerful fan systems. However, such solutions are usually not suitable for the onboard equipment due to various reasons: consumed power, cooling system capabilities (e.g. gas pressure in the unmanned spacecraft onboard equipment is very low and there is virtually no convection heat transfer). High requirements to vibration and shock resistance of the onboard equipment appear to be quite a different problem since such equipment could be exposed to harsh external effects during motion, which means that the onboard computing system should constantly maintain full operational capability.

In this case the use of computing systems with conduction cooling is seen as a rather efficient solution. This simultaneously provides the system with resistance to mechanical impacts and adequate heat removal. In such a situations heat emission from electronic components is sequentially transferred via several metallic heat-conducting parts to chassis enclosure from which it will be withdrawn by air or to the vehicle’s frame (e.g. when submersible vehicle is used). Today, lots of standards include sub-specifications with conduction cooling. Among the basic standards are VPX (several versions), CompactPCI Serial (in basic specification) and MicroTCA.3.

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Below is the description of Fastwel CPU modules and onboard computing system design with conduction cooling based on Fastwel CPC510 which complies with CompactPCI Serial standard.

Fastwel products

The heat removal system is one of the key factors indicating computer reliability. Using the simplified formula, computer operating life is reduced by half as the temperature increases by each 10 °С. The CompactPCI Serial standard is currently defines 2 module cooling types: convection (air) and conduction cooling.

The system based on conduction cooling is designed for installation of modules sized: 122×162 mm (3U), with a pitch of 5HP. Dimensions of CompactPCI Serial boards with conduction cooling differ from the standard ones. These boards are based on the standard module installed into a metal enclosure. This helps to sufficiently reduce the costs for manufacturing of boards with conduction cooling.

Due to the modifiability of any CompactPCI Serial board equipped with conduction cooling into a module with conduction heat-removal, users enjoy an opportunity to develop such conduction heat-removal systems «on the fly». Application of CompactPCI Serial boards enables to use skills and knowledge that have already been gathered, as well as tried and tested algorithms during upgrade of the already existing and development of new systems.

Fastwel product line includes CompactPCI-modules both with air cooling and conduction cooling. Currently these are the family of 3U devices. The proven Fastwel CompactPCI boards with conduction cooling are used as the basic modules.

All the modules are designed for the operation in industrial temperature range: −40…+85 °C.

Due to the design of modules with conduction heat removal, they often cannot be equipped with the complete set of connectors on the front panel, advanced LED- indication and extension bays. Usually all interfaces required for connection to peripheral devices, are implemented via the backplane and are located in the zone of rear I/O contacts.

CPC510 CPU module is developed for customers as the high integrity solution in CPCI Serial 3U form-factor with a purpose of use in real-time, control and high-speed data acquisition and processing systems. The module’s core is Intel Ivy Bridge CPU (2 cores).
CPC510 uses high-speed I/O interfaces (PCI-Express, Gigabit Ethernet) and supports modern video processing technologies. The modular design enables to flexibly set the system for a particular application area, optimizing the price-quality ratio.
Reliability of CPC510 makes it possible to use it in all industrial application areas. Components being the basis for CPC510, are carefully selected depending on the criteria of their applicability in harsh environments.

The module has the following structure of I/O channels:

  • 2 x Ethernet 1 Gb/s controllers (2 x are routed to the front panel);
  • 12 x USB 2.0 ports with support of HS, FS and LS speeds (2 x on the front panel, 2 x on mezzanine board, 8 x on the backplane connector)
  • 4 x USB 3.0 ports (routed to the backplane connector)
  • 6 x SATA ports (4 x ports are routed to the backplane connector, 1 x on the mezzanine connector, 1 x switchable backplane/mezzanine)
  • 1x DisplayPort is routed to the MIC590 board (to the front panel of CPC510-02)
  • 1x LVDS is routed to the MIC590 board
  • 2x DisplayPort on the front panel
  • HD Audio is routed to the mezzanine connector
  • LPC is routed to the mezzanine connector

CPC512 CPU module (including its conduction cooling version) will be available soon. The module will be aimed at buildinghigh-performance computing systems, operated in harsh environments and requiring high reliability and flexibility in support of various extension interfaces.The CPC512 module is similar to CPC510, but has some distinctions:

  • Instead of 2 x PCI-E switch Gen 2.0, CPC512 has one PCI-E switch Gen 3.0 with increased speed of data transfer (up to 8 Gb/s) and with DMA mode support which significantly reduces CPU load during data transfer. Apart from the retained operability of PCI Express ports in NT mode, the use of the new PCI-E switch Gen 3.0 has added support of the Host failover mode (failsafe mode for two CPC512 modules) for 2 x ports x8, routed to the backplane.
  • 2 x ports x4, routed to the backplane, started to support the increased speed of data transfer (up to 8 Gb/s)
  • Support of MIC590 mezzanine board has been stopped, this made possible to support PCI Express interface for all the slots of 8x slot backplane. Therefore, 4x PCI Express ports x1 Gen 2.0 are additionally routed to the backplane.
  • Support of Gigabit Ethernet operation via backplane with Intel AMT function has been added. The AMT (Advanced Management Technology) function actually is the advanced IPMI (Intelligent Platform Management Interface). It enables to remotely control CPU module operation, change system BIOS settings, reload or turn off the system as well as support Remote Desktop function.

 

Conduction Cooling System Design

Designing and development of the conduction cooling system usually begins with estimation of heat emission system and choosing the right enclosure which provides removal of the released thermal energy. Additionally, it is necessary to consider a place for enclosure installation, requirements for mechanical and climatic effects. Basically this represents a rather challenging engineering task and usually there are no serial enclosures for systems with conduction cooling. Computers with conduction cooling are always built for particular customers and systems.

Design of the onboard computing system with conduction cooling includes: modular chassis with backplane, power supply unit and computer modules in special heat-removing enclosures. The modules are secured by special expansion wedge locks and card locks. Therefore, heat will be transferred entirely to the module’s enclosure, from which it will be easily transferred to the enclosure and further to the ambient environment due to the large contact area between the enclosure and chassis frame, together with a high clamping force of wedge locks.

Modular structure of the system based on the platform concept enables users not only to build its system in compliance with the modular principle but also provides its easy expansion and development in the future.

Chassis is usually assembled from machine-cut aluminum components, bolted with each other. For manufacturing of these components various aluminum alloys can be used which correspond to the system customer requirements. Methods of final surface treatment can also vary: electrolytic anodizing (the best method in terms of the heat dissipation), electroless nickel plating, yellow chromate conversion coating etc. The chassis enclosure can be finned on the outside for the purpose of heat-removal improvement and can have a range of mounting holes and flanges for attaching various accessories, holding brackets and additional covers. The front and rear covers are usually symmetrical, can have different depths and can be reworked in accordance with customer requirements — equipped with holes for external connectors and switches.

Design of the chassis should provide the most efficient contact transfer of heat from active components to the chassis enclosure. System is manufactured in metallic enclosure, but first a detailed computer-aided simulation of its thermal conditions will be carried out. Its results will be used for project’s rework and it will be simulated until the result is considered fully appropriate.

Why to Choose Fastwel

Fastwel customers can always contact company’s engineers during design of the systems based on Fastwel CPU boards. Engineers will help selecting the right enclosures and systems either on the basis of System Partners product line (Elma) or based on Fastwel projects. Due to the long-term partner relations with leading companies specializing in the development and manufacturing of enclosures and chassis, Fastwel customers obtain professional technical support from a single source, and can count not only on module level solutions, but also on getting turnkey systems, manufactured in accordance with their individual requirements and corresponding to the most strict demands of industry standard, which even more contributes to applicability of Fastwel CompactPCI modules.

6U CPCI (PICMG 2.0, 2.1, 2.16) Intel Core I7-3555 LE, 2,5 GHz CPU module - the rugged heart of your sonar system

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Highly Efficient Multiprocessor Computers for Special Purpose Applications. The article describes a new rugged computer (-40C-+85C) for applications in sonar platforms, based on 6U CPCI (PICMG 2.0, 2.1, 2.16) Intel Core i7 CPU Module CPC503 developed by Fastwel.

INTRODUCTION

Modern computing technologies enable to develop high-performance solutions. Now it takes merely few hours to solve multiple tasks, which earlier required days. Large contribution to the computing performance was made by the introduction of parallel technologies and graphics cards (graphic accelerators) computing. However, the use of many up-to-date technologies for solving practical tasks in industrial and mission-criticalapplications is often problematic. This is stipulated by strict requirements of the conditions, under which the special-purpose computer is used. In particular, these are: mechanical limitations, consumed power and released heat. These limitations have been keeping us long from creating high-performance special-purpose computers, which are able to solve complex real-time tasks.

Architectures of industrial embedded systems have become very popular nowadays. They are based on special-purpose high-speed data buses such as CompactPCI and enable to create compact computing systems, corresponding to the strict requirements.

Fastwel Group develops multitasking computing systems, including those designed for mission-critical applications, as well as makesspecial-purpose software for such systems. Together with local system integrator, Fastwel has developed a multiprocessor compact scalable special-purpose computer,

Figure 1: Computing system architecture

designed for the use in civil sonar systems of new generation. The core features of these systems are their working range and possibility of monitoring location of passing transport, passenger and fishing vessels. The systems can also be used for obtaining information on seafloor topography required for geological research works.

ARCHITECTURE

The Box PC contains 6 CPU modules based on Inter Core i7 with 1.5 GHz and 4 GB RAM, connected to each other via CompactPCI bus (Fig.1). This bus is implemented though 2 CompactPCI/Ethernet switches, providing reliable operation of internal bus by redundancy and data transfer at the speed of up to 10 Gb/s. Computing modules specified as CPUMs (CPU modules) and PMs (processor modules), have similar architecture, but differ in terms of their functions. The CPUM is a control module receiving processed data, which then will be distributed over the PMs that perform parallel processing of such data. The computing system is implemented in 6U format based on Schroff 16-slot chassis, chosen due to its high reliability and proper ergonomic characteristics. External view of the system and one of its processor modules is shown on Fig.2

Main features of the computing system (Fig. 2b.) are as follows:

 

  • Intel Core i7-2610UE (1.5 GHz, 4 MB, 2 cores);
  • RAM: DDR3 SDRAM 4 GB (1333 MHz);
  • Wolf XMC-E6760-VO GPU accelerator;
  • Flash-drive: 4 GB (NAND, up to 100 Mb/s.);
  • HDD: 500 GB (SATA II).

Table1: Technical features of computing system

FeatureComputing system
Central Processing Unit (CPU) and form of manufacturingIntel Core i7-2610UE Sandy Bridge with GPU. Serial manufacturing
Process technology32 Nm
CPU frequency1.5 GHz
Number of CPU cores2
CPU performance18 GFLOPS
Performance1,2 TFLOPS
RAMDDR3 SDRAM 4 GB 1333 MHz
RAM size4 GB on cPCI board,
24 GB in 6 x cPCI — 6U
Disc drive sizeSATA II
Availability to install a floating-point unit or graphics processing unitAMD Radeon E6760 GPU
Operating systemMS Windows or Linux
Availability of standard x86/x86-64 programming toolsAvailable (for CPU). GPU programming is carried out by using OpenCL libraries
ECM resistanceHigh
Shock resistanceAverage
Power consumed by CPU20 W
Power consumed by cluster700 W
Dimensions450×500×300 mm

The system is additionally equipped with a powerful workstation, which includes NVIDEA Tesla GPU accelerators with CUDA technology support.In terms of its technical features (peak performance, consumed power, dimensions), the developed special-purpose computer is at the same level with the best domestic- and foreign-produced systems, and even outperforms them in some parameters.Structure of the system additionally provides:

  • Automatic control of fans operation mode;
  • Ability to install rear I/O modules;
  • Time after start required to make system ready for operation: 2 minutes;
  • Weight of no more than 50 kg;
  • Dimensions (W x H x D): 500×450×300 mm.

 

A distinctive feature of the special-purpose computing system is the use of AMD/ATI Radeon E6760 GPU accelerators. This enables not only to output video images but also use them for data processing in parallel with the CPU, which sufficiently increases general performance. Now in such systems it is possible to use GPU accelerators due to the special line of the Embedded chips manufactured by AMD company, as well as mezzanine boards based on such chips. Architecture and design of the computing system, depending on a task, makes it possible to use different numbers of GPU accelerators: from 0 to 6.

SUMMARY

Using hardware solutions, described in this article, enabled to develop a powerful special-purpose computing system. This computer helped to simulate and improve data-processing algorithms for civil sonar systems, making them more accurate. Due to its high performance, the equipment managed to simultaneously process information incoming from a large number of sensors which made it possible to increase accuracy of the obtained data on the seafloor topography required for geological research works, as well as monitoring of passing transport, passenger and fishing vessels. This was possible only because of paralleling and GPU accelerators. This is a clear confirmation that the use of such architecture solutions with GPU accelerators is highly promising.

CPU-based control system for oil and gas pipeline heaters

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CPU-based control system for oil and gas pipeline heaters

 

Crude oil is a product that is rather difficult to transport via pipelines due to the reason that it has a high viscosity level — the speed in this case would be low, therefore the throughput capacity would be low too. In order to increase the speed of feedstock movement inside the pipes, it should be diluted. One of the most efficient and cost-effective way to do it is to heat the crude oil, in which case the fluid viscosity becomes several times lower. This helped to solve one of the problems of crude oil transportation.

During the gas decompression process, due to the gas expansion, its temperature is reduced significantly. In which case, it could lead to appearance of frost and freezing of gearboxes and especially operation control panels, integrated into gas pressure reduction stations of the first level (high pressure). For ensuringtrouble-free operation of the stations, before the decompression process, it is required to heat the gas to such a temperature that after such a process, the temperature would remain within the limits from +5 to +10 °C. One of the most often used methods of natural gas heating in the stations is the use of continuous-flow heaters using fluid as a heat transfer agent.

The #PROINTEK hardware and software package is made to automate crude oil and gas real-time heating control processes, as well as to improve performance characteristics of the equipment.

The system is implemented on the basis of MicroPC processor Module CPC150*** from Fastwel (the module has been updated up to СРС152).

The system based on Fastwel CPU board performs functions of controlling gas burners of various types, maintaining temperature of the heated products, providing safety functions, practicing emergency operations and remote control. The heater control systems enable to unify design and software solutions, as well as to simplify adjustment of currently working equipment during its subsequent operation and modernization.

The control system has a convenient graphics interface for displaying current state of the controlled object and performing adjustments. Communication with the upper level of the process control system is carried out via RS-485interface.

The heaters are launched in automatic mode as follows:

  • Preliminary ventilation of the furnace unit;
  • Ignition of the pilot burner;
  • Ignition of the main burner in the low-burning mode;
  • Warming the furnace unit in the low-burning mode;
  • Switching to the standard operating procedure.

Normal operation mode ensures the two-step control of the heated crude oil temperature with indication of the current and set temperatures on operator’s panel screen. The control set can operate with analog or digital temperature sensors.

In addition to control block, the control system includes a power supply unit and a set of connecting cables.

The control system ensures safety shutdown of the controlled object by cutting-out the supply of fuel in case control parameters go beyond the acceptable limits. In such a case, an emergency sound alarm will be activated and a message with a reason for such a cutout will appear on operator’s panel screen. Information on the reason will be saved and maintained until manual reset of the emergency shutdown mode. After emergency shutdown, the controlled object will not be able to restart automatically.

In test mode, it is possible to test and set parameters of sensors and actuation devices. The mode has protection against unauthorized access to control block parameters.

The control system continuously operates on a 24-hour basis and meets the requirements, imposed to multichannel repairable and restorable systems.

“Sure-Cut® Meter” based on Fastwel rugged PC/104-Plus Intel Atom N450/D510 SBC

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Oil & Gas industry: Wellhead, Heavy Oil and Subsea applications


A standard Sure-Cut Meter system will consist of three modules:

- Piping Spool (1”, 2”, 3” or 4” etc.)
- RF Electronics Enclosure (usually mounted close to or pre-integrated with the Piping Spool)
- Computer Electronics Enclosure (can be mounted at a significant distance away).

The Sure-Cut meter can operate onshore, offshore and subsea. In some cases, Computer Electronics Enclosure could be installed together with other system components. This explains the strict requirements imposed to the rugged SBCs: resistance to salty mists and high level of shock/vibration as well as ability to operate in wide temperature range. From the other side, CPU module performance has less value instead of its reliability.

 

Due to all these factors and set of required interfaces, Fastwel`s PC/104-Plus Intel Atom N450/D510 SBC CPC308 has been chosen to be applied for this project.

Fastwel CPC308 is an embedded SBC in PC/104-Plus format (PCI 32-bit, ISA 16-bit) with an optimized CPU performance to heat emission ratio. CPC 308 is based on Intel Atom CPUs with integrated graphics and wide range of communication interfaces that insures the use of the Board in multitasking processing systems. CPC308 estimated power consumption is from 12 to 17 watts depending on model. Thermal design allows using both air cooling and conduction cooling.

The module includes CompactFlash socket, two Ethernet channels, four USB ports, two SerialATA ports, four serial ports and NAND Flash drive.

PC/104 and PC/104-Plus peripherals can be used for functionality expansion.

The module is supplied with preinstalled FreeDOS operating system (if the preinstalled operating system options are not selected) and is compatible with MS DOS 6.22, QNX 6.5, Windows XP Embedded, and Linux 2.6 operating systems.

3U CompactPCI Graphics Controller Module – Single Solution for 3 Applications

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The new VIM556 3U CompactPCI Graphics Controller Module enables Fastwel to expand its range of peripherals in 3U CompactPCI Serialformat. The module is intended for developers of mission-critical embedded systems requiring either high performance(1 teraflops or more) or data output to a large number of displays.

VIM556 may seem as a standard discrete graphics card with 4x DisplayPort interfaces (version 1.2) on the front panel. Each port enables to transfer an independent image with resolution of up to 3840 x 2160. However, support of DP Multi-Stream functionality should be considered, which enables to use 16 displays instead of 4 ones. That is to say that on a basis of VIM556 it is possible to build video walls. The displays in use may have other video inputs - DVI, HDMI – with connection to VIM556 through cost-efficient passive adapters due to the support of the Dual Mode.

picture22.jpgVIM556 being a graphics module carrier-board in MXM 3.0 Type A or B standard, allows developers to choose the module’s configuration with optimal performance and heat dissipation. The standard VIM556 version is equipped with the installed NVIDIA Quadro K2100M card with 576 cores, capable to perform multi-threaded computations and features 2 GB RAM. This "supercomputer-on-a-chip" is programmed using standard C ++ library with CUDA. According to NVIDIA, K2100M performance can reach up to 0.8 teraflops. The CompactPCI Serial standard allows developers to place up to 8x VIM556 modules in a single rack, which enhances the total system performance up to 6.5 teraflops. Considering the heat dissipation problem, we can say that the actual maximum performance of the computer based on VIM556 ranges from 3 to 4 teraflops. This is perfect for the embedded system, which occupies no more than 4-5U on the rack, depending on the version.

 

 

A third way to apply VIM556 in embedded systems is associated with the hardware-based algorithms of video signal processing, particularly decoding/encoding of HD-video, MPEG-2 HD/WMA HD, H.264, 16K rendering, FXAA / TXAA video image smoothing, AES decryption/encryption. VIM554 video input module can be used as a source of video and audio information.

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PCI Express x8 with bandwidth capacity of up to GEN2 5 Gb/s is the system interface for coupling with other CompactPCI Serial modules. The "thickness" of the channel may be even less – down to x1; operation of the module itself is not affected.

VIM556 has both – versions with a conventional finned heat sink made for the enclosures with air cooling and a conduction version with the width of 5 HP. Operating temperature range is 0 / + 70° or - 20 / + 70 °C for convection version, and -20 / + 55 °C for conduction version. VIM556, being equipped with MXM modules based on the AMD Radeon E8860 core, could operate within the following temperature range: from -40 to + 85°C.

Engineering samples are available for testing. Please send your requests at: Zhiltsov@fastwel.com.

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